Primary Capability
High-Complexity PCB
Advanced builds that combine multiple demanding requirements at once — high layer counts, fine features, mixed materials, or unusual mechanical constraints.
Overview
Advanced builds that combine multiple demanding requirements at once — high layer counts, fine features, mixed materials, or unusual mechanical constraints.
Why it matters
Some designs don't fit neatly into one category. A board might need HDI routing density, high-frequency performance, and high-Tg thermal stability at the same time.
Typical Applications
- Advanced compute and networking hardware
- Aerospace and defense electronics
- Multi-technology sensor and RF modules
- Designs pushing past a single fabrication category
Manufacturing Considerations
- Combining technologies compounds process complexity, not just cost
- Design-for-manufacture review matters more here than on any single-technology board
- Engineering collaboration early in the design cycle reduces late-stage surprises
Technical Characteristics
- Max layer count
- 120 layers
- Min trace / space
- 2.2 / 2.2 mil
- Min hole size
- 0.1 mm
- Standard materials
- 370HRS1000-2IT180AEM825
- Surface finish options
- HASL (Hot Air Solder Leveling)ENIG (Electroless Nickel Immersion Gold)Immersion TinOSP (Organic Solderability Preservative)Immersion SilverGold FingerElectroplated Hard GoldSelective OSPENEPIG
- Typical turnaround
- 15+ working days, quoted per design
Exact specifications are confirmed per order — send a spec through Request a Quote for a firm answer. Company-wide process limits are published on the Capabilities page.
Ready to spec a High-Complexity PCB?
Board type, quantity, layers, material — engineering reviews the full picture.