Primary Capability
Multilayer PCB
Three or more conductive layers laminated together, separating power, ground, and signal routing across dedicated planes.
Overview
Three or more conductive layers laminated together, separating power, ground, and signal routing across dedicated planes.
Why it matters
Dense designs need more routing area than a single board surface can provide, and dedicated ground and power planes improve signal integrity and reduce noise.
Typical Applications
- Industrial control systems
- Compute and networking hardware
- Automotive electronic control units
- Dense mixed-signal designs
Manufacturing Considerations
- Layer stack-up sequencing affects impedance control and manufacturability
- More layers generally mean tighter lamination tolerances
- Via structures — through, blind, buried — need to be planned alongside the stack-up, not after
Technical Characteristics
- Max layer count
- 120 layers
- Min trace / space
- 2.2 / 2.2 mil
- Min hole size
- 0.1 mm
- Standard materials
- 370HRS1000-2IT180AEM825
- Surface finish options
- HASL (Hot Air Solder Leveling)ENIG (Electroless Nickel Immersion Gold)Immersion TinOSP (Organic Solderability Preservative)Immersion SilverGold FingerElectroplated Hard GoldSelective OSPENEPIG
- Typical turnaround
- 5–10 working days (samples 5–7)
Exact specifications are confirmed per order — send a spec through Request a Quote for a firm answer. Company-wide process limits are published on the Capabilities page.
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Board type, quantity, layers, material — engineering reviews the full picture.