Products
High-Frequency PCB
Boards built on controlled-impedance substrates for RF, microwave, and high-speed digital signal paths.
Overview
Boards built on controlled-impedance substrates for RF, microwave, and high-speed digital signal paths.
Why it matters
Above certain frequencies, standard FR-4 dielectric behavior and routing tolerances introduce signal loss and reflection. High-frequency materials and controlled trace geometry keep signal integrity intact.
Typical Applications
- RF front-ends and antennas
- Radar and communications equipment
- High-speed digital interfaces
- Test and measurement instrumentation
Manufacturing Considerations
- Dielectric constant stability across frequency and temperature matters as much as the base material choice
- Trace geometry and reference planes must be controlled together to hit a target impedance
- Connector and via transitions are common sources of signal degradation if not modeled
Technical Characteristics
- Max layer count
- 20 layers (including hybrid stack-ups)
- Min trace / space
- 3 / 3 mil
- Min hole size
- 0.15 mm
- Standard materials
- Rogers 4350Rogers 4003Megtron 6Megtron 7
- Surface finish options
- ENIGENEPIGImmersion SilverOSP
- Typical turnaround
- 7–12 working days
Exact specifications are confirmed per order — send a spec through Request a Quote for a firm answer. Company-wide process limits are published on the Capabilities page.
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