Products
High Layer Count PCB
Boards with very high layer counts -- many signal, power and ground layers laminated into one stack -- for designs whose routing can't fit a conventional multilayer build. Stech fabricates stack-ups of up to 100 layers.
Overview
Boards with very high layer counts -- many signal, power and ground layers laminated into one stack -- for designs whose routing can't fit a conventional multilayer build. Stech fabricates stack-ups of up to 100 layers.
Why it matters
High pin-count processors, switch ASICs and test interfaces need more routing channels and more reference planes than a typical multilayer board offers -- and registration, drilling and plating accuracy all have to hold across the full stack.
Typical Applications
- Networking and telecom backplanes
- Data center and computing hardware
- High layer count optical modules
- ATE test boards and burn-in boards
Manufacturing Considerations
- Layer-to-layer registration becomes critical as the stack grows
- Thick boards need high aspect-ratio drilling and plating
- Back-drilling removes unused via stubs that degrade high-speed signals
- Laminate loss tier has a larger effect across many signal layers
Technical Characteristics
| Max layer count | Pending specification |
|---|---|
| Min trace / space | Pending specification |
| Min hole size | Pending specification |
| Standard materials | Pending specification |
| Surface finish options | Pending specification |
| Typical turnaround | Pending specification |
Exact specifications are confirmed per order -- send a spec through Request a Quote for a firm answer. Company-wide process limits are published on the Manufacturing Capabilities page.
Ready to spec a High Layer Count PCB?
Board type, quantity, layers, material -- engineering reviews the full picture.