Fabrication Capabilities
What Stech can fabricate.
Layer count, materials, signal integrity testing and the precision figures behind them -- the limits engineering works to when your design comes in.
- Max layer count
- 100
- HDI structure
- 8+N+8
- Inner-layer line / space
- 1.7 / 1.7 mil
- Impedance control
- ±5%
Capability Areas
Five areas, one fabrication line
From very high layer counts to embedded components -- grouped the way engineers usually ask about them.
Advanced Technology
- Layer count
- Up to 100 layers
- High layer count HDI PCBs
- Available
- High layer count optical modules
- Available
- ATE test boards and burn-in boards
- Available
Signal Integrity & Testing
- Insertion loss measurement
- SET2DIL / Delta L / VNA
Materials Expertise
- FR4 High Tg (ITG)
- Available
- Rogers 4350
- Available
- Rogers 4003
- Available
Advanced Capabilities
- Embedded components
- Capacitor / Resistance
- Copper coin technology
- Available
Precision & Engineering
- Max aspect ratio
- 30:1
- Trace width / spacing
- 1.7 / 1.7 mil
- Layer registration tolerance
- ±4 mil
- Back-drill stub length
- 0–4 mil
- Impedance control
- ±5%
Full process limits
Manufacturing Capabilities
The item-by-item table: HDI structure, microvias, board thickness, drill and registration.
Materials Expertise
Laminates across the loss range
FR4 High Tg (ITG), Rogers 4350 and Rogers 4003, plus low-loss materials graded from medium to ultra-low loss for high-speed designs.
| Loss tier | Materials | |
|---|---|---|
| Ultra Low Loss | M8M9M7 | |
| Very Low Loss | M6 | |
| Low Loss | M4 | |
| Medium Loss | M2 |
Bars show tier order only, lowest loss at the top -- not measured values.
These are process capabilities. What a specific design can achieve depends on its stack-up, materials and geometry, and is confirmed per order during engineering review.
Pushing one of these limits?
Send the stack-up and design data -- engineering will confirm what's achievable before you commit.