Manufacturing Capabilities
Process limits, item by item.
The technology items engineers check first -- layer count, HDI structure, line and space, drilling, registration and impedance -- in one table.
| Number | Technology item | Capability |
|---|---|---|
| 01 | Layer count (max) | 100 |
| 02 | HDI structure | 8+N+8 |
| 03 | Min line width / spacing | I/L: 1.7 mil / 1.7 milO/L: 3 mil / 3 mil (POFV) |
| 04 | Board thickness (max) | 7 mm |
| 05 | Min DHS | 6 mil |
| 06 | Aspect ratio | 35:1 |
| 07 | Min microvia size & aspect ratio | 3 mil & 1:1 |
| 08 | Min core thickness | 1 mil |
| 09 | Overall layer registration | 5 mil |
| 10 | Impedance tolerance | 5% |
| 11 | Back drill stub | 2–10 mil |
| 12 | Copper fill | Yes |
| 13 | Skip-via (L1–3) | Yes |
- I/L
- Inner layer
- O/L
- Outer layer
- POFV
- Plated over filled via
- DHS
- Drilled hole size
- HDI 8+N+8
- Eight build-up layers on each side of an N-layer core
Reading this table
These are process limits, not defaults. What a specific design can reach depends on its stack-up, materials and geometry, and is confirmed per order during engineering review.
Fabrication Capabilities
Materials, signal integrity testing, embedded components and copper coin.
Have a design near these limits?
Send the files -- engineering will confirm the build before you commit.