Products
Substrate-like PCB (SLP)
A PCB built with finer line width and spacing than conventional HDI, approaching the geometry of IC package substrates -- for designs where board area is at an absolute premium.
Overview
A PCB built with finer line width and spacing than conventional HDI, approaching the geometry of IC package substrates -- for designs where board area is at an absolute premium.
Why it matters
Higher I/O density and smaller components push routing below what conventional HDI geometry can carry. SLP narrows the gap between the board and the package substrate, freeing space for batteries and additional components in compact devices.
Typical Applications
- Smartphones and compact mobile devices
- Wearables
- Compact modules and system-in-package carriers
- Space-constrained consumer electronics
Manufacturing Considerations
- Fine line and space need tighter imaging and etching control than standard HDI
- Stacked microvias and registration tolerances are tight throughout the build
- Design rules sit at the limit of PCB fabrication -- confirm them with engineering early
Technical Characteristics
| Max layer count | Pending specification |
|---|---|
| Min trace / space | Pending specification |
| Min hole size | Pending specification |
| Standard materials | Pending specification |
| Surface finish options | Pending specification |
| Typical turnaround | Pending specification |
Exact specifications are confirmed per order -- send a spec through Request a Quote for a firm answer. Company-wide process limits are published on the Manufacturing Capabilities page.
Ready to spec a Substrate-like PCB (SLP)?
Board type, quantity, layers, material -- engineering reviews the full picture.