Capabilities
The limits to design to.
Process limits, line and space by copper weight, drilling, materials and assembly — in one place, with a checker for your own design rules.
- Max layer count
- 120
- HDI structure
- 8+N+8
- Inner-layer line / space
- 1.7 / 1.7 mil
- Impedance control
- ±5%
Process Limits
Item by item
| Technology item | Capability |
|---|---|
| Layer count (max) | 120 |
| HDI structure | 8+N+8 |
| Board thickness (max) | 7 mm |
| Min DHS | 6 mil |
| Aspect ratio | 35:1 |
| Min microvia size & aspect ratio | 3 mil & 1:1 |
| Min core thickness | 1 mil |
| Overall layer registration | 5 mil |
| Impedance tolerance | 5% |
| Back drill stub | 2–10 mil |
| Copper fill | Yes |
| Skip-via (L1–3) | Yes |
- DHS
- Drilled hole size
- HDI 8+N+8
- Eight build-up layers on each side of an N-layer core
Reading these limits
These are process limits, not defaults. Aspect ratio, layer registration and back-drill stub vary by board type; what a specific design can reach depends on its stack-up, materials and geometry, and is confirmed per order during engineering review.
Fabrication Capability Sheet
Bare-board process limits, materials and board technologies only. PDF, A4.
Capability Sheet
Fabrication, assembly, services and certifications on two pages. PDF, A4.
Line & Space
By layer and copper weight
Heavier copper etches with more undercut, so the minimum trace and gap grow with copper weight. Set your rules for the copper you're using.
| Layer | Copper | Trace | Space |
|---|---|---|---|
| Inner | ½ oz + plating | 1.7 mil | 1.7 mil |
| Inner | 1 oz | PendingPending confirmation | |
| Inner | 2 oz | 6 mil | 6 mil |
| Outer | ¼ oz + plating | 3 mil | 3 mil |
| Outer | ½ oz + plating | 4 mil | 4 mil |
Drilling
Holes and aspect ratio
Aspect ratio is board thickness divided by the drilled hole. The minimum hole and achievable ratio depend on board thickness.
- Smallest drilled hole
- 6 mil
- Aspect ratio
- 30:1 standard, up to 35:1
- Smallest microvia
- 3 mil, 1:1
- Board thickness
- Up to 7 mm
A breakdown of minimum hole and aspect ratio by board thickness is being prepared by engineering — until then, the overall limits above apply.
Design-Rule Check
Check your rules before you route
Enter the rules from your layout tool. Each value is compared with the limits on this page — beyond-capability values are flagged so you can adjust before sending files.
Everything entered is within capability
Board thickness · Within capability
1.6 mm is within the 7 mm maximum.
A quick check against published process limits, not a DFM review — engineering confirms every design before fabrication.
Fabrication
Five capability areas
From very high layer counts to embedded components — grouped the way engineers usually ask about them.
Advanced Technology
- Layer count
- Up to 120 layers
- High layer count HDI PCBs
- Available
- High layer count optical modules
- Available
- ATE test boards and burn-in boards
- Available
Signal Integrity & Testing
- Insertion loss measurement
- SET2DIL / Delta L / VNA
Materials Expertise
- FR4 High Tg (ITG)
- Available
- Rogers 4350
- Available
- Rogers 4003
- Available
Advanced Capabilities
- Embedded components
- Capacitor / Resistance
- Copper coin technology
- Available
Precision & Engineering
- Max aspect ratio
- 30:1
- Trace width / spacing
- 1.7 / 1.7 mil
- Layer registration tolerance
- ±4 mil
- Back-drill stub length
- 0–4 mil
- Impedance control
- ±5%
By board type
PCB technologies
Layer count, trace and space, hole size, materials and finishes for each board type.
Materials
Laminates across the loss range
FR4 High Tg (ITG), Rogers 4350 and Rogers 4003, plus Megtron low-loss laminates graded from medium to ultra-low loss for high-speed designs.
| Loss tier | Materials | |
|---|---|---|
| Ultra Low Loss | Megtron 8Megtron 9Megtron 7 | |
| Very Low Loss | Megtron 6 | |
| Low Loss | Megtron 4 | |
| Medium Loss | Megtron 2 |
Bars show tier order only, lowest loss at the top — not measured values.
Assembly
PCB assembly limits
SMT, through-hole and mixed assembly on the boards we fabricate — or on yours.
- Assembly types
- SMT, through-hole (THT) and mixed technology
- Board sides
- Single- and double-sided assembly
- Smallest passive components
- 01005 (0402 metric)
- Fine-pitch packages
- BGA and QFN down to 0.35 mm pitch, with X-ray inspection
- Board size
- Up to 460 × 500 mm; boards under 70 × 70 mm assembled in panels
- Order quantity
- No minimum; 1-piece prototypes through volume production
- Soldering
- Lead-free (RoHS) and leaded
- Workmanship standard
- IPC-A-610 Class 2 and Class 3
- Component supply
- Full turnkey, consigned or partially consigned
Inspection & test
- Solder paste inspection (SPI)
- Automated optical inspection (AOI)
- X-ray inspection
- In-circuit test (ICT)
- Functional test
Have a design near these limits?
Send the files — engineering will confirm the build before you commit.